MONOLITHIC IC
It is that the components such as semiconductor materials,passive components(resistor,capacitor,inductor and transformer) etc ,which is used in ic is fabricated within the single semiconductor(say silicon) wafer and there is no such shortages between the components and this have separate pn junctions. All the functions of the components are within the small silicon wafer and the technology used here to manufacture this ic is PLANAR TECHNOLOGY
HYBRID IC
It is that the components are connected individualy through the wires and the surrounded by the special polymer called EPOXY ,this is the technology used while comparing with the monolithic ic it is big in size.it contain the components all such used in the monolithic type
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