fiberglass,
phenolic resin
epoxy resin
tin
copper (board and cladding and internal power/ground planes/wire traces)
tin and antimony and/or cadmium
possibly lead (solder)
rosin and/or ammonium chloride (flux)
brass/gold/silver (contacts)
plastic
lacquer
varnish
paint
Aluminum/steel (heat sinks)
gallium
aluminum oxide
rubber
Barium and/or beryllium oxide and silicone grease(heat sink heat transfer compounds)
silicon
paper
polypropylene
polyethylene
gold/platinum/copper (semiconductor internal connections)
lithium/silver (battery)
glass
I am sure that things are missing from this list but this is everything i could think of.
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